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Xiner DIP26 is fully compatible with an imported brand, using a mature and reliable aluminum substrate process, product stability, and flexibility for customization. At present, the product has been widely used in air conditioners, frequency converters, elevator door machines, inverter refrigerators, inverter washing machines and other markets.

DIP26 IPM Features and Benefits:

• Simple application, fully compatible with imported brands, direct replacement, saving R&D investment;

• Low thermal resistance achieved by aluminum substrate process, more uniform heat distribution;
  - The aluminum substrate process is mature and stable, has high reliability, and is easy to control interface voids and has high thermal conductivity.
  - The aluminum substrate process enables flexible customization and low cost.

• HVIC with built-in SOI process, perfect protection function;
  -Using Infineon's driver ICs, it represents the most advanced driver control level in the industry.
  - With dead zone control, and the short circuit protection, turns off 6 IGBTs at the same time, which is safe.

• Complete test data, mature market application;
  - In addition to wafer flow and package testing, the core can perform a full inspection of each manufactured product to ensure product quality.
  - High short-circuit tolerance, each passed the 10uS short-circuit test (400V/15V/150°C).

• The product is subject to market inspection and is cost effective;
  -Using core energy independent 600V/15A IGBT wafers, the wafer shipments exceeded 1 million units per month.
  - Core is committed to helping system vendors save costs and increase product competitiveness.